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Advances and Applications in Electroceramics II: Ceramic by K. M. Nair, Shashank Priya

By K. M. Nair, Shashank Priya

With contributed papers from the 2011 fabrics technology & expertise symposia, this can be a priceless one-stop source for knowing crucial matters within the advances and functions of electroceramics. Logically prepared and thoroughly chosen, the articles disguise the topics of the symposia: Magnetoelectric Multiferroic skinny movies and Multilayers; Dielectric Ceramic fabrics and digital units; and Multifunctional Oxide. a vital reference for presidency labs and teachers in mechanical and chemical engineering, fabrics and or ceramics, and chemistry.Content:

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Temperature of samples was stabilized within 10 mK using a lock-in bridge technique with a PtlOO resistor as a thermometer. Figures 4 and 5 show temperature and frequency dependence of ε' and ε", respectively. Comparison of measured dielectric data in Figures 4 and 5 to modelled dielectric behavior in Figures 1 and 2 in both cases reveals artificial Debye relaxation with characteristic relaxation frequency, which increases on increasing temperature. For analysis of the detected dielectric response, equivalent circuit from Figure lc has been applied as the material is composed of semiconducting grains and insulating grain boundaries.

Phys, 48, 05EB02 (2009). 6 M. D. K. Schenck, W. Wong-Ng, and M. Green, A High-throughput thermoelectric Screening Tool for Rapid Construction of Thermoelectric Phase Diagrams, Appl. Phys. , 91, 132102-132104 (2007). 7 M. Otani, K. Itaka, W. K. Schenck, and H. Koinuma, Development of highthroughput thermoelectric tool for combinatorial thin film libraries, Appl. Surface Science, 254, 765-767 (2007). 8 J. Horäk, P. LoStäk, L. Koudelka and R. Novotny, Solid State Communications, Vol. 55, No. 11, pp.

Jie, Q. Li, J. Martin, G. Nolas, H. Obara, J. Sharp, R. Venkatasubramanian, R. Willigan, J. Yang, and T. Tritt, Round-Robin Studies of Two Potential Seebeck Coefficient Standard Reference Materials, Appl. Phys. A, (Materials Science & processing), 94, 231-234 (2009). "Z. Q. J. Lu, N. D. Lowhorn, W. Wong-Ng, W. Zhang, E. Thomas, M. Otani, M. Green, T. N. Tran, C. Caylor, N. Dilley, A. Downey, B. Edwards, N. Eisner, S. Ghamaty, T. Hogan, Q. Jie, Q. Li, J. Martin, G. Nolas, H. Obara, J. Sharp, R. Venkatasubramanian, R.

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